Merge tag 'thermal-5.20-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm

Pull thermal control updates from Rafael Wysocki:
 "These start a rework of the handling of trip points in the thermal
  core, improve the cpufreq/devfreq cooling device handling, update some
  thermal control drivers and the tmon utility and clean up code.

  Specifics:

   - Consolidate the thermal core code by beginning to move the thermal
     trip structure from the thermal OF code as a generic structure to
     be used by the different sensors when registering a thermal zone
     (Daniel Lezcano).

   - Make per cpufreq / devfreq cooling device ops instead of using a
     global variable, fix comments and rework the trace information
     (Lukasz Luba).

   - Add the include/dt-bindings/thermal.h under the area covered by the
     thermal maintainer in the MAINTAINERS file (Lukas Bulwahn).

   - Improve the error output by giving the sensor identification when a
     thermal zone failed to initialize, the DT bindings by changing the
     positive logic and adding the r8a779f0 support on the rcar3
     (Wolfram Sang).

   - Convert the QCom tsens DT binding to the dtsformat format
     (Krzysztof Kozlowski).

   - Remove the pointless get_trend() function in the QCom, Ux500 and
     tegra thermal drivers, along with the unused DROP_FULL and
     RAISE_FULL trends definitions. Simplify the code by using clamp()
     macros (Daniel Lezcano).

   - Fix ref_table memory leak at probe time on the k3_j72xx bandgap
     (Bryan Brattlof).

   - Fix array underflow in prep_lookup_table (Dan Carpenter).

   - Add static annotation to the k3_j72xx_bandgap_j7* data structure
     (Jin Xiaoyun).

   - Fix typos in comments detected on sun8i by Coccinelle (Julia
     Lawall).

   - Fix typos in comments on rzg2l (Biju Das).

   - Remove as unnecessary call to dev_err() as the error is already
     printed by the failing function on u8500 (Yang Li).

   - Register the thermal zones as hwmon sensors for the Qcom thermal
     sensors (Dmitry Baryshkov).

   - Fix 'tmon' tool compilation issue by adding phtread.h include
     (Markus Mayer).

   - Fix typo in the comments for the 'tmon' tool (Slark Xiao).

   - Make the thermal core use ida_alloc()/free() directly instead of
     ida_simple_get()/ida_simple_remove() that have been deprecated
     (keliu).

   - Drop ACPI_FADT_LOW_POWER_S0 check from the Intel PCH thermal
     control driver (Rafael Wysocki)"

* tag 'thermal-5.20-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (39 commits)
  thermal/of: Initialize trip points separately
  thermal/of: Use thermal trips stored in the thermal zone
  thermal/core: Add thermal_trip in thermal_zone
  thermal/core: Rename 'trips' to 'num_trips'
  thermal/core: Move thermal_set_delay_jiffies to static
  thermal/core: Remove unneeded EXPORT_SYMBOLS
  thermal/of: Move thermal_trip structure to thermal.h
  thermal/of: Remove the device node pointer for thermal_trip
  thermal/of: Replace device node match with device node search
  thermal/core: Remove duplicate information when an error occurs
  thermal/core: Avoid calling ->get_trip_temp() unnecessarily
  thermal/tools/tmon: Fix typo 'the the' in comment
  thermal/tools/tmon: Include pthread and time headers in tmon.h
  thermal/ti-soc-thermal: Fix comment typo
  thermal/drivers/qcom/spmi-adc-tm5: Register thermal zones as hwmon sensors
  thermal/drivers/qcom/temp-alarm: Register thermal zones as hwmon sensors
  thermal/drivers/u8500: Remove unnecessary print function dev_err()
  thermal/drivers/rzg2l: Fix comments
  thermal/drivers/sun8i: Fix typo in comment
  thermal/drivers/k3_j72xx_bandgap: Make k3_j72xx_bandgap_j721e_data and k3_j72xx_bandgap_j7200_data static
  ...

3 files changed, 107 insertions, 65 deletions

diff --git a/Documentation/devicetree/bindings/thermal/qcom,spmi-temp-alarm.yaml b/Documentation/devicetree/bindings/thermal/qcom,spmi-temp-alarm.yaml
new file mode 100644
index 000000000000..5f08b6e59b8a
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/qcom,spmi-temp-alarm.yaml
@@ -0,0 +1,85 @@
+# SPDX-License-Identifier: GPL-2.0-only OR BSD-2-Clause
+%YAML 1.2
+---
+$id: http://devicetree.org/schemas/thermal/qcom,spmi-temp-alarm.yaml#
+$schema: http://devicetree.org/meta-schemas/core.yaml#
+
+title: Qualcomm QPNP PMIC Temperature Alarm
+
+maintainers:
+  - Bjorn Andersson <bjorn.andersson@linaro.org>
+
+description:
+  QPNP temperature alarm peripherals are found inside of Qualcomm PMIC chips
+  that utilize the Qualcomm SPMI implementation. These peripherals provide an
+  interrupt signal and status register to identify high PMIC die temperature.
+
+allOf:
+  - $ref: thermal-sensor.yaml#
+
+properties:
+  compatible:
+    const: qcom,spmi-temp-alarm
+
+  reg:
+    maxItems: 1
+
+  interrupts:
+    maxItems: 1
+
+  io-channels:
+    items:
+      - description: ADC channel, which reports chip die temperature
+
+  io-channel-names:
+    items:
+      - const: thermal
+
+  '#thermal-sensor-cells':
+    const: 0
+
+required:
+  - compatible
+  - reg
+  - interrupts
+  - '#thermal-sensor-cells'
+
+additionalProperties: false
+
+examples:
+  - |
+    #include <dt-bindings/interrupt-controller/arm-gic.h>
+
+    pmic {
+        #address-cells = <1>;
+        #size-cells = <0>;
+
+        pm8350_temp_alarm: temperature-sensor@a00 {
+            compatible = "qcom,spmi-temp-alarm";
+            reg = <0xa00>;
+            interrupts = <0x1 0xa 0x0 IRQ_TYPE_EDGE_BOTH>;
+            #thermal-sensor-cells = <0>;
+        };
+    };
+
+    thermal-zones {
+        pm8350_thermal: pm8350c-thermal {
+            polling-delay-passive = <100>;
+            polling-delay = <0>;
+            thermal-sensors = <&pm8350_temp_alarm>;
+
+            trips {
+                pm8350_trip0: trip0 {
+                    temperature = <95000>;
+                    hysteresis = <0>;
+                    type = "passive";
+                };
+
+                pm8350_crit: pm8350c-crit {
+                    temperature = <115000>;
+                    hysteresis = <0>;
+                    type = "critical";
+                };
+            };
+        };
+    };
diff --git a/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt b/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt
deleted file mode 100644
index 2d5b2ad03314..000000000000
--- a/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt
+++ /dev/null
@@ -1,51 +0,0 @@
-Qualcomm QPNP PMIC Temperature Alarm
-
-QPNP temperature alarm peripherals are found inside of Qualcomm PMIC chips
-that utilize the Qualcomm SPMI implementation. These peripherals provide an
-interrupt signal and status register to identify high PMIC die temperature.
-
-Required properties:
-- compatible:      Should contain "qcom,spmi-temp-alarm".
-- reg:             Specifies the SPMI address.
-- interrupts:      PMIC temperature alarm interrupt.
-- #thermal-sensor-cells: Should be 0. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description.
-
-Optional properties:
-- io-channels:     Should contain IIO channel specifier for the ADC channel,
-                   which report chip die temperature.
-- io-channel-names: Should contain "thermal".
-
-Example:
-
-	pm8941_temp: thermal-alarm@2400 {
-		compatible = "qcom,spmi-temp-alarm";
-		reg = <0x2400>;
-		interrupts = <0 0x24 0 IRQ_TYPE_EDGE_RISING>;
-		#thermal-sensor-cells = <0>;
-
-		io-channels = <&pm8941_vadc VADC_DIE_TEMP>;
-		io-channel-names = "thermal";
-	};
-
-	thermal-zones {
-		pm8941 {
-			polling-delay-passive = <250>;
-			polling-delay = <1000>;
-
-			thermal-sensors = <&pm8941_temp>;
-
-			trips {
-				stage1 {
-					temperature = <105000>;
-					hysteresis = <2000>;
-					type = "passive";
-				};
-				stage2 {
-					temperature = <125000>;
-					hysteresis = <2000>;
-					type = "critical";
-				};
-			};
-		};
-	};
-
diff --git a/Documentation/devicetree/bindings/thermal/rcar-gen3-thermal.yaml b/Documentation/devicetree/bindings/thermal/rcar-gen3-thermal.yaml
index 1368d90da0e8..0f05f5c886c5 100644
--- a/Documentation/devicetree/bindings/thermal/rcar-gen3-thermal.yaml
+++ b/Documentation/devicetree/bindings/thermal/rcar-gen3-thermal.yaml
@@ -8,9 +8,9 @@ $schema: http://devicetree.org/meta-schemas/core.yaml#
 title: Renesas R-Car Gen3 Thermal Sensor
 
 description:
-  On R-Car Gen3 SoCs, the thermal sensor controllers (TSC) control the thermal
-  sensors (THS) which are the analog circuits for measuring temperature (Tj)
-  inside the LSI.
+  On most R-Car Gen3 and later SoCs, the thermal sensor controllers (TSC)
+  control the thermal sensors (THS) which are the analog circuits for
+  measuring temperature (Tj) inside the LSI.
 
 maintainers:
   - Niklas Söderlund <niklas.soderlund@ragnatech.se>
@@ -27,6 +27,7 @@ properties:
       - renesas,r8a77965-thermal # R-Car M3-N
       - renesas,r8a77980-thermal # R-Car V3H
       - renesas,r8a779a0-thermal # R-Car V3U
+      - renesas,r8a779f0-thermal # R-Car S4-8
 
   reg: true
 
@@ -57,31 +58,38 @@ required:
   - "#thermal-sensor-cells"
 
 if:
-  not:
-    properties:
-      compatible:
-        contains:
-          enum:
-            - renesas,r8a779a0-thermal
+  properties:
+    compatible:
+      contains:
+        enum:
+          - renesas,r8a779a0-thermal
 then:
   properties:
     reg:
-      minItems: 2
       items:
+        - description: TSC0 registers
         - description: TSC1 registers
         - description: TSC2 registers
         - description: TSC3 registers
-  required:
-    - interrupts
+        - description: TSC4 registers
 else:
   properties:
     reg:
+      minItems: 2
       items:
-        - description: TSC0 registers
         - description: TSC1 registers
         - description: TSC2 registers
         - description: TSC3 registers
-        - description: TSC4 registers
+  if:
+    not:
+      properties:
+        compatible:
+          contains:
+            enum:
+              - renesas,r8a779f0-thermal
+  then:
+    required:
+      - interrupts
 
 additionalProperties: false